The Wall Street Journal 2026-10-16-3
AI Chips’ New Secret Sauce Is Packaging
The WSJ finds AI chip gains now come more from packaging than from transistor shrinking, and packaging capacity has bottlenecked Nvidia's sales. TSMC converted old fabs and expanded capacity several times over, and is pulling packaging in-house from what used to be a low-margin outsourced business. That is the physical ceiling under Jensen's supply story, and it limits how many leases Nvidia can usefully stand behind.